Soitec Announces Piezoelectric-on-insulator Substrates Agreement with Qualcomm Technologies for 5g RF Filters

Soitec’s required a piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. For this Soitec is moving into a business agreement with Qualcomm Technologies, Inc. for the supply of those piezoelectric-on-insulator (POI) engineered substrates. Soitec Euronext Paris designs and manufactures innovative semiconductor materials.

Soitec’s piezoelectric-on-insulator substrate will set a solid organization to smartphones’ 5G filters for the mass markets. It is an agreement for Soitec to secure supply for Qualcomm Technologies’ new generation of RF filters as after collaboration with Qualcomm Technologies for years, Soitec moved into an agreement to increase the manufacturing volume of POI wafers production. Those POI wafers will be used for Qualcomm Technologies’ RF filters works in the smartphones RF front end modules.

Senior vice president and general manager of Qualcomm Germany Christian Block RFFE GmbH said, “With our game-changing thin-film technology and innovation in the Qualcomm® ultraSAW RF filter products, we continue to push the boundaries of what’s possible in mobile technology.”

Senior Executive Vice President of the Soitec’s Global Business Units, Dr. Bernard Aspar said “This business agreement is the outcome of a collaboration between Soitec and Qualcomm Technologies. We are very pleased that Soitec POI substrates are now an important part of Qualcomm Technologies’ 5G offering for mobile devices.”

He added further that being manufacturer of innovative substrate, Soitec has significant experience in serving RF markets with large RF-SOI volumes. “We are confident in our ability to handle high-volume production for POI to become a standard in materials for 5G RF filters, thanks to our robust and proven Smart CutTM technology.”

POI is an advanced substrate manufactured with the use of Soitec’s proprietary Smart CutTM technology in 150 mm. POI engineered substrates is designed to be compatible and provide a unique value for building a latest generation of 4G/5G Surface Acoustic Wave (SAW) filters. The perform averagely built-in temperature compensation.

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